Simcenter Micred T3STER
Hardware for thermal characterization
Simcenter Micred T3STER (pronounced “Tris-ter”) is a modern, non-destructive transient heat tester for the thermal characterization of packed semiconductor devices (diodes, bipolar transistors [BJTs], metal-oxide-semiconductor field-effect transistors [MOSFETs], bipolar transistors with isolated gate electrodes [IGBTs], current LEDs) and multi-die devices that can test components on the spot. Our solution is a proprietary system of software and hardware and supports the semiconductor, transportation, consumer electronics and LED markets.
Measuring the true transient thermal response is much more efficient than stationary methods. Measurements are made down to ±0.01° C with a temporal resolution of up to 1 microsecond and thus achieve accurate thermal key figures. Structural functions process the responses into a plot that displays the thermal resistance and thermal capacity of package features along the heat flow path. Defects in the structure, for example in die fasteners, can be easily determined – making this solution an ideal tool for detecting pre- and post-stressing errors in reliability analysis. Measurements can be exported for the calibration of thermal models and prove the accuracy of the thermal design.
